Edge connect wafer level stacking

ABSTRACT

A stacked microelectronic assembly includes a first stacked subassembly and a second stacked subassembly overlying a portion of the first stacked subassembly. Each stacked subassembly includes at least a respective first microelectronic element having a face and a respective second microelectronic element having a face overlying and parallel to a face of the first microelectronic element. Each of the first and second microelectronic elements has edges extending away from the respective face. A plurality of traces at the respective face extend about at least one respective edge. Each of the first and second stacked subassemblies includes contacts connected to at least some of the plurality of traces. Bond wires conductively connect the contacts of the first stacked subassembly with the contacts of the second stacked subassembly.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation of Ser. No. 13/086,645 filed Apr. 14,2011, which is a divisional of U.S. application Ser. No. 12/908,265filed Oct. 20, 2010, now U.S. Pat. No. 8,022,527, which is a divisionalof U.S. application Ser. No. 11/787,209 filed Apr. 13, 2007, now U.S.Pat. No. 7,829,438, which is a continuation-in-part of U.S. applicationSer. No. 11/704,713, filed Feb. 9, 2007. U.S. application Ser. No.11/704,713 claims the benefit of the filing date of U.S. ProvisionalPatent Application No. 60/850,850 filed Oct. 10, 2006. The disclosuresof said applications are hereby incorporated herein by reference.

BACKGROUND OF THE INVENTION

The present invention generally relates to stacked microelectronicpackages including stacked microelectronic packages fabricated at thewafer level and to methods of making such packages.

Semiconductor chips are flat bodies with contacts disposed on the frontsurface that are connected to the internal electrical circuitry of thechip itself. Semiconductor chips are typically packaged with substratesto form microelectronic packages having terminals that are electricallyconnected to the chip contacts. The package may then be connected totest equipment to determine whether the packaged device conforms to adesired performance standard. Once tested, the package may be connectedto a larger circuit, e.g., a circuit in an electronic product such as acomputer or a cell phone.

The substrate materials used for packaging semiconductor chips areselected for their compatibility with the processes used to form thepackages. For example, during solder or other bonding operations,intense heat may be applied to the substrate. Accordingly, metal leadframes have been used as substrates. Laminate substrates have also beenused to package microelectronic devices. Such substrates may include twoto four alternating layers of fiberglass and epoxy, wherein successivefiberglass layers may be laid in traversing, e.g., orthogonal,directions. Optionally, heat resistive compounds such as bismaleimidetriazine (BT) may be added to such laminate substrates.

Tapes have been used as substrates to provide thinner microelectronicpackages. Such tapes are typically provided in the form of sheets orrolls of sheets. For example, single and double sided sheets ofcopper-on-polyimide are commonly used. Polyimide based films offer goodthermal and chemical stability and a low dielectric constant, whilecopper having high tensile strength, ductility, and flexure has beenadvantageously used in both flexible circuit and chip scale packagingapplications. However, such tapes are relatively expensive, particularlyas compared to lead frames and laminate substrates.

Microelectronic packages also include wafer level packages, whichprovide a package for a semiconductor component that is fabricated whilethe die are still in a wafer form. The wafer is subject to a number ofadditional process steps to form the package structure and the wafer isthen diced to free the individual die. Wafer level processing mayprovide a cost savings advantage. Furthermore, the package footprint canbe identical to the die size, resulting in very efficient utilization ofarea on a printed circuit board (PCB) to which the die will eventuallybe attached. As a result of these features, die packaged in this mannerare commonly referred to as wafer level chip scale package (WLCSP).

In order to save space certain conventional designs have stackedmultiple microelectronic chips within a package. This allows the packageto occupy a surface area on a substrate that is less than the totalsurface area of the chips in the stack. However, conventional stackedpackages have disadvantages of complexity, cost, thickness andtestability.

In spite of the above advances, there remains a need for improvedwafer-scale packages and especially stacked wafer-scale packages thatare reliable, thin, testable and that are economical to manufacture.

SUMMARY OF THE INVENTION

The present invention provides apparatus and methods for production ofintegrated circuit devices to create stacked microelectronic packagessuitable for processing at a wafer level to produce integrated circuitsof lower cost, smaller size, lower weight, enhanced electricalperformance.

In accordance with a preferred embodiment of the present invention, amethod for producing integrated circuit devices is provided includingthe steps of forming a microelectronic assembly by stacking a firstsubassembly including a plurality of microelectronic elements onto asecond subassembly including a plurality of microelectronic elements,wherein the microelectronic elements have traces extending to theiredges, then forming notches partway through the microelectronic assemblyso as to expose the traces and subsequently forming leads at thesidewalls of the notches to provide electrical contacts on a planarsurface of the assembly. Subsequently, the assembly is diced in order toform individual electronic elements in accordance with the preferredembodiment of the present invention. The step of forming notches extendsonly partway through the at least one subassembly allows continuedwafer-level processing of the elements.

In an additional embodiment of the present invention, the stackedassemblies incorporate a substrate to provide additional mechanicalintegrity to the assembly both during and after processing. Thesubstrate may incorporate relief cavities that reduce stressconcentrations during the notching process. It has been found thatwithout such cavities, there is a propensity for the substrate to crackduring the notching process.

In another aspect of the invention, adhesives are used to laminate thevarious layers of microelectronic subassemblies. Because of the stackingmethod, the traces of each subassembly are supported and retained by theadhesive of the immediate layer below and thereby prevented from beingdamaged.

In a still further preferred embodiment of the invention, each layer isinitially notched to expose the traces and then filled with adhesiveduring the laminating process and this pattern of notching and fillingis repeated for each of the subassembly layers. In this manner, when thenotching occurs that will differentiate the microelectronic elements,the notching occurs entirely through the adhesive layers and the tracesso that the traces are mechanically supported and insulated by theadhesive during the notching process.

It is a further aspect to the invention that the initial notchingprocess is performed by non-mechanical means such as etching in order topreserve the mechanical integrity of the traces so that they remainintact.

It is an additional aspect of the present invention that stackedmicroelectronic packages comprising four subassembly layers and asubstrate layer may have an overall package thickness of no more than155 micrometers and that this thickness may be reduced by reducing thethickness of the substrate to a stacked thickness of no more than 125micrometers.

In another embodiment of the invention, the stacked electronic packageshave traces formed to both the top and bottom surfaces so that thestacked packages may be in turn stacked because the respective contactson top and bottom layers of the packing can be aligned.

In a further preferred embodiment of the invention a method of making astacked microelectronic package includes the steps of a) forming amicroelectronic assembly by stacking a first subassembly including aplurality of microelectronic elements onto a substrate, stacking asecond subassembly including a plurality of microelectronic elementsonto the first subassembly, at least some of the plurality ofmicroelectronic elements of the first subassembly and the secondsubassembly having traces that extend to respective edges of themicroelectronic elements; b) forming notches in the microelectronicassembly so as to expose the traces of at least some of the plurality ofmicroelectronic elements; and c) forming leads at the side walls of thenotches, the leads being in electrical communication with at least someof the traces. In a further aspect of this embodiment the step offorming notches optionally includes forming initial notches in at leastthe first subassembly so as to expose the traces and filling the initialnotches with adhesive so as to cover the traces and forming initialnotches in at least the second subassembly so as to expose the tracesand filling the initial notches with adhesive so as to cover the tracesand forming the notches in the adhesive so as to expose the traces of atleast some of the plurality of microelectronic elements.

An addition embodiment of the invention includes a method of making amicroelectronic subassembly including the steps of a) forming initialnotches in a first subassembly, including a plurality of microelectronicelements, the subassembly having traces that extend to respective edgesof the microelectronic elements, so as to expose the traces; b) fillingthe initial notches with adhesive so as to cover the traces; and c)forming notches in the adhesive so as to expose the traces of at leastsome of the plurality of microelectronic elements.

An additional embodiment of the invention is a stacked microelectronicpackage including four subassemblies and a substrate stacked to eachother, each subassembly including at least one microelectronic chipwhere the package has a stack thickness of no more than 155 micrometers.Such a package without a substrate has a stack thickness of no more than125 micrometers.

An additional preferred embodiment of the invention is a method ofmaking a stacked microelectronic package including the steps of a)forming a microelectronic assembly by stacking a first subassemblyincluding a plurality of microelectronic elements onto the adhesivelayer of a substrate, at least some of the plurality of microelectronicelements of the first subassembly having traces that extend torespective edges of the microelectronic elements; and then b) forminginitial notches in the first subassembly so as to expose the traces andcoating an adhesive layer on the first subassembly so as to fill theinitial notches with adhesive and cover the traces; and then c) stackinga second subassembly including a plurality of microelectronic elementsonto the adhesive layer of the first subassembly, at least some of theplurality of microelectronic elements of the first subassembly havingtraces that extend to respective edges of the microelectronic elements;and then d) forming initial notches in the second subassembly so as toexpose the traces and coating an adhesive layer on the secondsubassembly so as to fill the initial notches with adhesive and coversaid traces; and then e) forming notches in the adhesive layers so as toexpose the traces of at least some of the plurality of microelectronicelements; and f) forming leads at the side walls of the notches, theleads being in electrical communication with at least some of thetraces.

In one embodiment of the invention, a method is provided formanufacturing a stacked package. In such method, the saw lanes of afirst wafer can be aligned with saw lanes of a second wafer such thatthe saw lanes of one wafer are positioned above the saw lanes of theother wafer. Each of the first and second wafers may include a pluralityof microelectronic elements attached together at the saw lanes. Eachmicroelectronic element may also have a plurality of traces extendingtoward the saw lanes. A plurality of openings can be formed which arealigned with the saw lanes of the first wafer and the second wafer. Eachopening may expose a single trace of at least one microelectronicelement. Leads can then be electrically connected with at least some ofthe exposed plurality of traces.

Each opening may expose a single trace of a microelectronic element ofthe first wafer. The same opening may also expose a single trace of amicroelectronic element of the second wafer. Each opening may expose asingle trace of more than microelectronic elements of the first wafer.The same opening may also expose a single trace of one or more than onemicroelectronic elements of the second wafer.

In one embodiment, the first wafer may be attached to the second waferafter the saw lanes of the two wafers are aligned.

In one embodiment, the leads may include first ends which overlie a faceof one of the first and the second wafers. The first ends of the leadsmay include conductive bumps.

In one embodiment, The first and second wafers may be severed along thesaw lanes into a plurality of assemblies, where each assembly includes aplurality of stacked microelectronic elements and exposed leads.

The saw lanes of at least one additional wafer including a plurality ofadditional microelectronic elements may be attached together at the sawlanes with the saw lanes of the first and second wafers.

The plurality of microelectronic elements may have additional traceswhich extend towards the saw lanes. Single ones of the additional tracesof at least one of the additional microelectronic elements may beexposed during the step of forming the openings.

In accordance with an aspect of the invention, a stacked microelectronicassembly is provided which includes a first stacked subassembly and asecond stacked subassembly overlying a portion of the first stackedsubassembly. Each stacked subassembly may include a firstmicroelectronic element having a face. A second microelectronic elementhaving a face may overlie and be parallel to the face of the firstmicroelectronic element. Each of the first and second microelectronicelements may have edges extending away from the respective face. Aplurality of traces at the respective face may extend about at least onerespective edge. Each of the first and second stacked subassemblies mayinclude contacts connected to at least some of the plurality of traces.Bond wires may conductively connect the contacts of the first stackedsubassembly with the contacts of the second stacked subassembly.

In one embodiment, each of the first and second subassemblies may have aface, and at least some of the plurality of contacts be exposed at atleast one of the faces of the first and second subassemblies.

Each of the first and second stacked subassemblies may have a face andan edge extending away from the face. The face of the first stackedsubassembly may extend beyond the face of the second stacked subassemblysuch that contacts at the face of the first stacked subassembly areexposed beyond the face of the second stacked subassembly.

In accordance with an aspect of the invention, a stacked microelectronicpackage is provided which may include a plurality of subassemblies,e.g., a first subassembly and a second subassembly underlying the firstsubassembly. Each subassembly may have a front face and a rear faceremote from the front face. The front face of the second subassembly mayconfront the rear face of the first subassembly. Each of the first andsecond subassemblies may include a plurality of front contacts exposedat the front face, at least one edge and a plurality of front tracesextending about the respective at least one edge. The second subassemblymay have a plurality of rear contacts exposed at the rear face. Thesecond subassembly may also have a plurality of rear traces extendingfrom the rear contacts about the at least one edge. The rear traces mayextend to at least some of the plurality of front contacts of at leastone of the first or second subassemblies.

In one embodiment, each of the plurality of subassemblies includes atleast one microelectronic chip. An assembly including themicroelectronic package may further include a circuit panel havingterminals conductively connected to at least some package contacts,e.g., selected from the group consisting of the rear contacts of thesecond subassembly and front contacts of one subassembly of theplurality of subassemblies.

An additional microelectronic chip can be joined to the stackedmicroelectronic package or assembly. In one embodiment, a face of theadditional microelectronic chip confronts a face of one of the first andsecond subassemblies. The assembly may further include bond wires whichconductively connect contacts of the additional microelectronic chip tothe terminals of the circuit panel.

Contacts of the additional microelectronic chip may be wire-bonded tothe front contacts of the one subassembly. Conductive masses may jointhe contacts of the additional microelectronic chip to the frontcontacts of the one subassembly.

In one embodiment, the additional microelectronic chip may include amicrocontroller.

In one embodiment, one or more microelectronic chips in the plurality ofsubassemblies may be replaceable by the additional microelectronic chip.For example, a microelectronic chip of the assembly can be replaced bydisconnecting the microelectronic chip from ones of the front contactsof one subassembly and then connecting the additional microelectronicchip to the ones of the front contacts.

The assembly may further include bond wires which conductively connectthe front contacts of the one subassembly to the terminals of thecircuit panel.

In one embodiment, conductive masses may join the contacts of theadditional microelectronic chip to the front contacts of the onesubassembly.

In one embodiment, conductive masses may join the terminals of thecircuit panel to the exposed front contacts of the one subassembly.

An additional microelectronic chip may be joined to the rear face of thesecond subassembly. In such assembly, the additional microelectronicchip may have contacts conductively connected to terminals of thecircuit panel.

Bond wires may join the contacts of the additional microelectronic chipto the terminals of the circuit panel.

In one embodiment, conductive masses may join the terminals of thecircuit panel to the rear contacts of the second subassembly.

In an embodiment, an additional microelectronic chip may have contactsin conductive communication with the front contacts of the onesubassembly.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A is a top view of a subassembly according to one embodiment ofthe present invention;

FIG. 1B is a cross-sectional view of the subassembly of FIG. 1A;

FIG. 2 is a cross-sectional view of a plurality of subassembliesattached to one another to form a stacked assembly;

FIG. 3 is a cross-sectional view of the stacked assembly of FIG. 2 at alater stage during a method of manufacture according to one embodimentof the present invention;

FIG. 4A is a cross-sectional view of the stacked assembly of FIG. 3 at alater stage of manufacture according to one embodiment of the presentinvention;

FIG. 4B is a cross-sectional blown-up view of a portion of the stackedassembly of FIG. 4A.

FIG. 5 is a cross-sectional view of the stacked assembly of FIG. 4Aafter the stacked assembly has been diced into individual units;

FIG. 6 is a cross-sectional view of an alternate embodiment of a stackedassembly according to an embodiment of the present invention; and

FIG. 7A is a top view of a subassembly according to one embodiment ofthe present invention;

FIG. 7B is a cross-sectional view of the subassembly of FIG. 7A.

FIG. 7C is a bottom-view of the subassembly of FIG. 1A;

FIG. 8 is a cross-sectional view of a substrate used in an additionalembodiment of the invention using a substrate to form a stackedassembly;

FIG. 9 is a cross-sectional view of the substrate of FIG. 8 at a laterstage during a method of manufacture according to one embodiment in thepresent invention;

FIG. 10 is a cross-sectional view of the substrate of FIG. 9 at a laterstage during the method of manufacture according to one embodiment ofthe present invention;

FIG. 11 is a cross-sectional view of a stacked assembly wherein thesubassembly of FIG. 7A-C is stacked on top of a substrate of FIG. 10during a later stage of manufacture according to one embodiment of thepresent invention;

FIG. 12 is a cross-sectional view of the stacked assembly of FIG. 11 ata later stage during a method of manufacture according to one embodimentof the present invention;

FIG. 13 is a cross-sectional view of the stacked assembly of FIG. 12 ata later stage during a method of manufacture according to one embodimentof the present invention;

FIG. 14 is a cross-sectional view of the stacked assembly of FIG. 13 ata later stage during a method of manufacture according to one embodimentof the present invention;

FIG. 15 is a cross-sectional view of the stacked assembly of FIG. 14 ata later stage during a method of manufacture according to one embodimentof the present invention;

FIG. 16 is a cross-sectional view of the stacked assembly of FIG. 15 ata later stage during a method of manufacture according to one embodimentof the present invention;

FIG. 17 is a cross-sectional view of the stacked assembly of FIG. 16 ata later stage during a method of manufacture according to one embodimentof the present invention;

FIG. 18 is a cross-sectional view of the stacked assembly of FIG. 17 ata later stage during a method of manufacture according to one embodimentof the present invention;

FIG. 19 is a cross-sectional view of the stacked assembly of FIG. 18 ata later stage during a method of manufacture according to one embodimentof the present invention;

FIG. 20 is a cross-sectional view of an alternative embodiment of astacked assembly based on the assembly shown in FIG. 19;

FIG. 20A is a sectional view illustrating a stacked microelectronicassembly in which individual stacked assemblies are further stacked oneon top of the other and conductively connected to each other.

FIG. 21 is a cross-sectional view of the stacked assembly of FIG. 19after the stacked assembly has been diced into individual units;

FIG. 22 is a cross-sectional view of an individual element created bythe dicing process of FIG. 21 configured for wire bonding;

FIG. 23 is a cross-sectional view of an individual element according toFIG. 21 configured for bonding using a solder ball.

FIG. 24 is a bottom view of a variation of the stacked assemblyillustrated in FIG. 21.

FIGS. 25A and 25B are illustrations of apparatus typically employed inthe manufacture of stacked assemblies discussed herein.

FIG. 26 is a sectional view of a stacked assembly as attached to acircuit panel in accordance with an embodiment of the invention.

FIG. 27 is a sectional view of a stacked assembly as attached to acircuit panel in accordance with a variation of the embodimentillustrated in FIG. 26.

FIG. 28 is a sectional view of a stacked assembly as attached to acircuit panel in accordance with another variation of the embodimentillustrated in FIG. 26.

FIG. 29 is a sectional view of a stacked assembly as attached to acircuit panel in accordance with another embodiment of the invention.

FIG. 30 is a sectional view of a stacked assembly as attached to acircuit panel in accordance with a variation of the embodimentillustrated in FIG. 29.

FIG. 31 is a sectional view of a stacked assembly as attached to acircuit panel in accordance with another variation of the embodimentillustrated in FIG. 29.

FIG. 32 is a sectional view of a stacked assembly as attached to acircuit panel in accordance with another embodiment of the invention.

DETAILED DESCRIPTION

Reference is now made to FIGS. 1-4B, which illustrate a method andapparatus for stacking microelectronic components. As shown in FIGS.1A-1B, a portion of a first wafer or subassembly 10 includes a pluralityof microelectronic elements 12, each positioned side by side andadjacent to one another. The first wafer or subassembly 10 preferablyincludes numerous rows of microelectronic elements 12 aligned along anX-axis and a Y-axis. The microelectronic elements are formed integralwith one another using conventional semiconductor process techniques. Itshould be apparent that the subassembly 10 may be a portion of a wafer.And the broken lines in the FIG. 1A illustrate that the subassembly mayhave additional elements attached thereto and may be in the shape of acircular wafer.

Each microelectronic element 12 includes a front face 14 and anoppositely-facing rear face 16. The microelectronic elements 12 alsoinclude first edges 18, second edges 20, third edges 19 and fourth edges21, all of which extend from the front faces 14 to the rear faces 16 ofthe microelectronic elements 12. As shown in FIGS. 1A-1B, a first edge18 of one microelectronic element 12 is attached to a second edge 20 ofa second and adjacent microelectronic element 12. Similarly, a thirdedge 19 of one microelectronic element 12 is attached to a fourth edge21 of an adjacent microelectronic element. Thus, the microelectronicelements 12 positioned within the middle of the first subassembly 10 arebordered by an adjacent microelectronic element 12 at all four edges, asshown in FIG. 1A. The microelectronic elements 12 positioned at a firstend 11, a second end 13, a third end 15 or a fourth end 17 of the waferhave at least one edge unencumbered by an additional microelectronicelement. Although the edges are depicted in the drawings for clarity ofillustration, in practice the edges may not be visible. Rather, at thisstage, the edges or strips where adjacent microelectronic elements 12contact one another are saw lanes or strips where the wafer can be cutwithout damaging the individual microelectronic elements. For instance,as shown in FIG. 1B, second edge 20′ of microelectronic element 12′abuts first edge 18″ of microelectronic element 12″ and forms a saw lane23. Similarly, throughout the wafer 10, saw lanes 23 are located atpositions where microelectronic elements 12 abut one another. The firstwafer/subassembly 10 may include any number of microelectronic elements12 including as little as two or as many as is desirable.

Each of the microelectronic elements 12 also includes a plurality ofcontacts 22 exposed at the respective front face 14 of themicroelectronic element 12. Further, a trace 24 extends outwardly fromeach of the contacts 22 to a respective first, second, third or fourthedge 18, 20, 19, and 21 of the individual microelectronic element 12.For example, with reference to FIG. 1B, trace 24′ extends outwardly fromcontact 22′ towards the second edge 20′ of microelectronic element 12′.The trace 24′ extends to and contacts trace 24″, which extends outwardlyfrom contact 22″. Thus, traces 24′ and 24″ meet at the attachment pointof microelectronic elements 12′ and 12″ and may actually form a singletrace extending between contact 22′ and contact 22″. However, it is notrequired that the traces actually contact one another. Similarstructures may be included for all adjacent microelectronic elements 12.Once again, contacts 22, which are positioned at the respective ends ofthe first subassembly 10 do not have traces 24 that extend to anadjacent contact on a different microelectronic element, but ratherthese traces 24 simply extend to a respective end of the first assembly10.

As shown in FIG. 2, to create a stacked assembly 30, the firstsubassembly 10 is positioned over a second wafer/subassembly 10A andthird wafer/subassembly 10B. The second subassembly and thirdsubassembly 10A, 10B are similarly constructed to the first subassembly10 and thus like elements will be given similar character referencesunless otherwise specified. The stacked assembly 30 of FIG. 2 includesthree individual wafers/subassemblies stacked one upon another, but inalternate embodiments the stacked assembly 30 may include less or morewafers/subassemblies positioned on top of each other.

As shown in FIG. 2, the microelectronic elements 12 of the firstsubassembly 10 are aligned with the microelectronic elements 12A of thesecond subassembly 10A and the microelectronic elements 12B of the thirdsubassembly 10B. Thus, the respective first, second, third and fourthedges of each of the microelectronic elements 12, 12A, 12B of therespective subassemblies 10, 10A, 10B are also aligned alonglongitudinal axes. Therefore, the respective saw lanes 23, 23A and 23Bof each of the subassemblies are also aligned with one another. Thestacked assembly 30 consists of a plurality of microelectronic elements12, 12A, 12B, oriented and aligned in various rows and columns.

To attach the individual subassemblies 10, 10A, 10B to one another, anadhesive layer 32 is positioned between the front face 14 of the firstsubassembly 10 and the rear face 16A of the second subassembly 10A.Similarly, an adhesive layer 33 is also positioned between the frontface 14A of the second subassembly 10A and the rear face 16B of thethird subassembly 10B. An additional adhesive layer 35 may also bedisposed on the front face 14B of the third subassembly 10B so as toprotect the contacts 22B and traces 24B of the third subassembly 10B.The adhesive layers 32, 33, 35 may be formed from an epoxy or the like.

Once assembled, the adhesive layers 32, 33, 35 are allowed to cure suchthat the respective subassemblies 10, 10A, 10B are adhered to oneanother and form stacked assembly 30, which includes a plurality ofmicroelectronic elements 12, 12A, 12B stacked adjacent to and upon oneanother.

With reference to FIG. 3, next, a plurality of notches 46 may be cutinto the stacked assembly 30. The notches 46 are preferably formed usinga mechanical cutting instrument not shown in the figures. Examples ofsuch a mechanical cutting instrument can be found in U.S. Pat. Nos.6,646,289 and 6,972,480, the disclosures of which are herebyincorporated by reference herein. The notches 46 are cut from thestacked assembly 30 at locations that are proximate the respective firstedges 18, 18A, 18B, second edges 20, 20A and 20B, third edges 19, 19A,19B and fourth edges 21, 21A, 21B of the respective microelectronicelements 12, 12A, 12B of the various subassemblies 10, 10A, 10B. Thenotches 46 are formed by cutting gaps 47 at the saw lanes 23, 23A and23B. Since the saw lanes 23, 23A and 23B of each of the subassemblies10, 10A 10B are aligned throughout the stacked assembly 30, a single cutmay be used to form the gaps 47 between multiple subassemblies.Preferably, the notches 46 do not extend entirely through the stackedassembly 30. For instance, as shown in FIG. 3, the microelectronicelements 12 of the first subassembly 10 remain attached to each other asthe various notches 46 do not extend entirely through the firstsubassembly. However, the notches 46 do extend far enough so as tointersect the traces 24 of the first subassembly 10 that extend betweencontacts 22 exposed at adjacent microelectronic elements 12. Similarly,the notches 46 dissect not only the various adhesive layers 32, 33, 35interconnecting the subassemblies 10, 10A, 10B but also adjacentmicroelectronic elements 12A, 12B and respective traces 24, 24A, 24B ofeach subassembly. Although the notches 46 are illustrated havinginclined side walls 48, 50, the side walls may also be straight.

For example, notch 46A of FIG. 3 intersects microelectronic element 52and microelectronic element 54 of second subassembly 10A. The notch 46Aintersects the two microelectronic elements 52, 54 such that the variousedges of each of the microelectronic elements, which were previouslyattached to one another and formed saw lane 23 are separated by a gap47. The gap 47 created by the notch 46A exposes the traces 56 and 58adjacent the notch 46A. A similar structure is preferably included forall of the edges of the various microelectronic elements throughout thestacked assembly 30. The exposed traces 24, 24A, 24B form contactsurfaces for each of the microelectronic elements 12, 12A, 12B. Ofcourse, the first edge 60 and second edge 62 of the stacked assembly 30does not have to be mechanically cut because the traces that extendtoward these respective edges are already exposed. Although not shown inFIG. 3, the first and second edge 60, 62 may also be mechanically cut soas to create a more symmetrical configuration. Similarly, the edges ofthe stacked assembly 30 not shown in the figures also do not have to bemechanically cut although it may be desirable.

Once the various notches 46 have been created in the stacked assembly30, leads 66 may be formed on the inclined side walls 48, 50 of notches46. The inclined side walls 48, 50 extend through at least part of thevarious first, second and third subassemblies, 10, 10A, 10B, that werecreated as a result of the notches 46, as shown in FIGS. 4A and 4B. Theleads 66 may be formed by any suitable metal deposition technique, forexample, a process that includes sputtering, three-dimensionallithography and electroplating. Additional processes may also beemployed. One such process is disclosed in U.S. Pat. No. 5,716,759, thedisclosure of which is hereby incorporated by reference herein. Theleads 66 extend within the various notches 46, and establish electricalcontact with the traces 24, 24A and 24B. Preferably the leads 66 extendpast the inclined side walls 48, 50 of notches 46 and are exposed at afirst surface 70 of the adhesive layer 35 positioned below the thirdsubassembly 10B. Therefore, the leads 66 include ends 75 remote fromnotches 46 and exposed on the surface of adhesive layer 35. Pads orsolder bumps 74 may be formed at the ends 75 of the leads 66. Each lead66 is in contact with three traces 24, 24A, 24B as a result of thetraces being aligned and exposed at a respective inclined side wall 48or 50. However, the leads 66 may be in electrical connection with onlyone or two of the traces 24, 24A, 24B at a respective inclined side wall48 or 50. Such an orientation may be as a result of the positioning ofthe traces 24, 24A, 24B in different planes that are into and out of thepage as viewed by the reader. For example, trace 24 illustrated in FIG.4B may be offset from trace 24A so that trace 24 is closer to the readerif viewing in a three-dimensional orientation. The lead 66, which isaligned with trace 24, is also offset from trace 24A and not in contactwith trace 24A. So although in a two-dimensional view, the traces 24,24A may appear to be attached to lead 66 in FIG. 4B, only one may beactually attached to the lead.

As shown in FIG. 5, after the notches 46 and various conductive elementsincluding leads 66 are formed in the stacked assembly 30, individualpackages 80 may be created by mechanically cutting through the wafer 10of microelectronic elements 12 of the first subassembly 10. Themicroelectronic elements 12 of the first subassembly 10 are cut atlocations that are proximate the notches 46 such that the notches 46 areallowed to extend entirely through the stacked assembly 30. Once thecuts have been performed, a plurality of stacked individual units 80 arecreated, with each stacked individual unit 80 containing a plurality ofmicroelectronic elements stacked one upon another. The stackedindividual units 80 may be electrically connected to a microelectronicelement such as a substrate 83, circuit board or circuit panel via thesolder bumps 74, as shown in FIG. 5.

The stacked individual unit 80 may be incorporated into microprocessorsand RF units among other assemblies but may be particularly adaptablefor Flash Memory and DRAM units.

In an alternate embodiment, as shown in FIG. 6, the stacked assembly 130may include an additional substrate such as packaging layer 180. Stackedassembly 130 is similarly constructed to stacked assembly 30 discussedpreviously with regard to FIGS. 1-5 and includes most if not all of thesame features discussed with regard to stacked assembly 30. In addition,stacked assembly 130 may be constructed following steps previouslydiscussed with regard to stacked assembly 30. The only addition tostacked assembly 130 as compared to stacked assembly 30 is that duringthe manufacture of the stacked assembly 130 and preferably prior tocreating notches in the stacked assembly 130, a packaging layer 180 ispositioned below compliant layer 135. The packaging layer 180 ispreferably formed of glass, silicon or a similar material. Once thepackaging layer 180 has been positioned adjacent to the adhesive layer135, a plurality of notches 146 are formed using a cutting instrument,as discussed with regard to stacked assembly 30. This exposes traces124, 124A, 124B at the inclined side walls, 148, 150 of the notches 146.Further, a plurality of leads 166 may then be created on the inclinedside walls 148, 150 and be placed in electrical contact with the varioustraces 124, 124A, 124B exposed at the inclined side walls, 148, 150 ofthe notches 146 as discussed with regard to stacked assembly 30. Thevarious leads 166 preferably extend beyond the notches 146 and onto afront surface 182 of the packaging layer 180. Exposed ends 175 of theleads 166 may include pads or solder bumps 174. Although not shown inFIG. 6, once the various notches and conductive elements have beenformed, the notches may be extended through the row of microelectronicelements 112 of the first subassembly 110 so as to create individualstacked units 180.

In an alternate embodiment, as shown in FIGS. 7-22, the stacked assembly230 may include an additional substrate such as packaging layer 201.Stacked assembly 230 is similarly constructed to stacked assemblies 30and 130 discussed previously with regard to FIGS. 1-7, except that theassembly starts with substrate layer 201, and includes many of the samefeatures discussed with regard to stacked assembly 30 and 130. Inaddition, stacked assembly 230 may be constructed following stepspreviously discussed with regard to stacked assemblies 30 and 230.

As shown in FIGS. 7A-7C, a portion of a first wafer or subassembly 210includes a plurality of microelectronic elements 212, each positionedside by side and adjacent to one another. The first wafer or subassembly210 preferably includes numerous rows of microelectronic elements 212aligned along an X-axis and a Y-axis. The microelectronic elements areformed integral with one another using conventional semiconductorprocess techniques. It should be apparent that the subassembly 210 maybe a portion of a wafer and that the various components are replicatedrepeatedly over the extent of the wafer. The FIGS. 7A-7C illustrate thatthe subassembly may have additional elements attached thereto and may bein the shape of a circular wafer.

Each microelectronic element 212 includes a front face 214 and anoppositely-facing rear face 216. The microelectronic elements 212 alsoinclude first edges 218, second edges 220, third edges 219 and fourthedges 221, all of which extend from the front faces 214 to the rearfaces 216 of the microelectronic elements 212. As shown in FIGS. 7A-7C,a first edge 218 of one microelectronic element 212 is attached to asecond edge 220 of a second and adjacent microelectronic element 212.Similarly, a third edge 219 of one microelectronic element 212 isattached to a fourth edge 221 of an adjacent microelectronic element.Thus, the microelectronic elements 212 positioned within the middle ofthe first subassembly 210 are bordered by an adjacent microelectronicelement 212 at all four edges, as shown in FIG. 7A. The microelectronicelements 212 positioned at a first end 211, a second end 213, a thirdend 215 or a fourth end 217 of the wafer have at least one edgeunencumbered by an additional microelectronic element. Although theedges are depicted in the drawings for clarity of illustration, inpractice the edges may not be visible. Rather, at this stage the edgesor strips where adjacent microelectronic elements 212 contact oneanother are saw lanes or strips where the wafer can be cut withoutdamaging the individual microelectronic elements. For instance, as shownin FIG. 7B, second edge 220′ of microelectronic element 212′ abuts firstedge 218″ of microelectronic element 212″ and forms a saw lane 223.Similarly, throughout the wafer 210, saw lanes 223 are located atpositions where microelectronic elements 212 abut one another. The firstwafer/subassembly 210 may include any number of microelectronic elements212 including as little as two or as many as are desirable.

Each of the microelectronic elements 212 also includes a plurality ofcontacts 222 exposed at the respective front face 14 of themicroelectronic element 212 best seen in FIG. 7C. Further, a trace 224extends outwardly from each of the contacts 222 to respective edges 218,220, 219, and 221 of the individual microelectronic element 212. Thetraces 224 may meet at the attachment point of microelectronic elements212′ and 212″ and may actually form a single trace extending betweencontact 222′ and contact 222″. However, it is not required that thetraces actually contact one another. Similar structures may be includedfor all adjacent microelectronic elements 212. Once again, contacts 222,which are positioned at the respective ends of the first subassembly 210do not have traces 224 that extend to an adjacent contact on a differentmicroelectronic element, but rather these traces 224 simply extend to arespective end of the first assembly 210.

In contrast to the embodiments discussed in connection with FIGS. 1-6,the embodiment of FIGS. 7-22 is shown constructed in stacked fashionfrom the substrate upwards. Consequently, many of the various componentsand processes are depicted in inverted fashion related to the earlierfigures.

A packaging support wafer or layer 201 with substrate 202 for thestacked assembly of this embodiment is shown in FIG. 8. The substrate202 is preferably formed of glass, silicon or a similar material thatprovides sufficient mechanical strength to support and reinforce thesubsequent layers of the stacked assembly. For this reason, thesubstrate 202 may be thicker than the subsequent layers. The substratelayer 202 material may also be thinned or even removed during laterprocess steps by etching or mechanically polishing when support is nolonger needed. The substrate has a lower surface 205 and an uppersurface 206 and extends to a leftward side 203 and rightward surface204. Depicted in FIG. 9 are a plurality of relief cavities 208 and 208′created in the upper surface 206. These cavities 208 are aligned withthe anticipated positions of saw lanes for severing the stackedpackages. The cavities 208, 208′ are created by mechanical cuttinginstruments as described above for the stacked assemblies 30 and 130.The relief cavities 208, 208′ function as a stress relief to preventfracture of the stacked assemblies due to notching of the substrate 202during subsequent operations. Consequently, the cavities 208 arepreferably formed with corner radii to alleviate stress concentrations.After forming the cavities 208, 208′ an adhesive layer 209 is applied tothe upper surface 206 and the cavities 208, 208′ as shown in FIG. 10.Preferably the adhesive layer has a thickness over the upper surface 206of 2.5-4.0 micrometers.

As shown in FIG. 11, to create a stacked assembly, the first subassembly212 is positioned over the substrate layer 201. As depicted, thecontacts 222, 222′ and traces 224, 224′ are aligned with the respectivecavities 208, 208′ and thus saw lanes 218 and 222. The active lowersurface 214 and the traces 224 and 224′ are applied to the adhesivelayer 209 of the substrate layer 201 and the adhesive is cured. Thesubassembly 210, including the traces 224 and 224′ are bonded to andsupported by the substrate layer 201.

If desired, the upper surface 216 of the subassembly 210 may be thinnedto create a new surface 216′ and reduce the height of the subassembly asshown in FIG. 12. Preferably the reduced height of the subassembly is22.4-25.4 micrometers if a compact stacked package is desired.

With reference to FIG. 13, next, a plurality of initial notches 240,240′ may be formed into the subassembly 210 to expose the traces 224,224′. The notches 240, 240′ are preferably formed using non-mechanicaltechniques such as selective chemical etching in order to preserve thedelicate traces 240, 240′. The traces 240, 240′ are adhered to andsupported by the adhesive 209 of the substrate 201 during this step. Theinitial notches 240, 240′ are aligned with the contacts 222, 222′, thetraces 224, 224′ the cavities 208, 208′ and saw lanes 218 and 222. Theprofile of the initial notches 40, 41 is configured to provide clearancefor later notches as will be described.

After forming initial notches 240, 240′, an adhesive layer 243 isapplied to the upper surface 216 or 216′ and the initial notches 40,40′, as shown in FIG. 14. Preferably the adhesive layer has a thicknessover the upper surface 216 or 216′ of approximately 2.5-4.0 micrometers.

As shown in FIGS. 15 and 16, second, third and fourth subassemblies,designated 210A, 210B and 210C respectively, are aligned withsubassembly 210, stacked and laminated sequentially upward fromsubassembly 210 and substrate layer 201. The same sequence of stepsearlier followed to laminate subassembly 210 to substrate 201 is used tolaminate each of subassemblies 210A, 210B and 210C. The steps includingalignment, lamination, curing, thinning, creation of initial notches andapplication of adhesive are followed sequentially for each step tocreate the stacked assembly 230. Thus microelectronic elements 212 ofthe first subassembly 210 are aligned with the microelectronic elements212A of the second subassembly 210A, the microelectronic elements 212Bof the third subassembly 210B, and the microelectronic elements 212C ofthe third subassembly 210C. Therefore, the initial notches 240, 240′,240A, 240A′, 240B, 240B′, 240C, 240C′, are respectively aligned with thecontacts 222, 222′, 222A, 222A′, 222B, 222B′, 222C, 222C′, the traces224, 224′, 224A, 224A′, 224B, 224B′, 224C, 224C′, the cavities 208, 208′and the saw lanes 218 and 222. In summary, the stacked assembly 230consists of a plurality of stacked and adhered microelectronic elements12, 12A, 12B, 12C oriented and aligned in various rows and columns.

The notches 246 are cut from the stacked assembly 230 at locations thatare proximate the respective first edges 218, 218A, 218B, and 218C,second edges 220, 220A, 220B and 220C, third edges 219, 219A, 219B, 219Cand fourth edges 221, 221A, 221B, 221C of the respective microelectronicelements 12, 12A, 12B, 12C of the various subassemblies 10, 10A, 10B,10C. The notches 246, 247 are formed at the saw lanes 220, 218 by themethods described for the earlier embodiments. As seen in FIG. 17, onenotable difference from the earlier embodiments is that the plurality ofnotches 246 are cut through the adhesive layers 243, 243A, 243B, 243C.Preferably, the notches 246 do not extend entirely through the stackedassembly 230 but rather extend only partially into the relief cavities208, 208′. Thus the substrate 202 remains intact to connect the stackedmicroelectronic elements and is protected from cracking because theadhesive 209 rather that the substrate is cut. Although the notches 246are illustrated having inclined side walls 248, 250, the side walls mayalso be straight.

The stacked assembly 230 of FIG. 17 includes four individualwafers/subassemblies stacked one upon another, but in alternateembodiments the stacked assembly 230 may include less or morewafers/subassemblies positioned on top of each other. Also shown in FIG.17 is an optional thinning of the substrate 202 which may beaccomplished by mechanical polishing or etching. This step may beperformed between various steps in the process, preferably afterformation of the notches 246.

Once the various notches 246 have been created in the stacked assembly230, leads 266 may be formed on the inclined side walls 248, 250 ofnotches 246. The inclined side walls 248, 250 extend through at leastpart of the various first, second, third and fourth subassemblies 210,210A, 210B, 210C that were created as a result of the notches 246, asshown in FIGS. 17 and 18. The leads 266 may be formed by any suitablemetal deposition technique as described for the previous embodiments.The leads 266 extend within the various notches 246, and establishelectrical contact with the traces 224, 224A, 224B and 224C.

Preferably the leads 266 extend past the inclined side walls 248, 250 ofnotches 246 and are adhered to the adhesive layer 243C on the uppersurface 216C′ of the third subassembly 210C. Therefore, the leads 266include ends 275 remote from notches 246 and exposed on the surface ofadhesive layer 243C.

Each lead 266 is in contact with four traces 224, 224A, 224B, 224C as aresult of the traces being aligned and exposed at respective inclinedside walls 248 or 250. However, the leads 266 may be in electricalconnection with less than four of the traces 224, 224A, 224B, 224C at arespective inclined side wall 48 or 50. Such an orientation may be as aresult of the positioning of the traces 224, 224A, 224B, 224C indifferent planes that are into and out of the page as viewed by thereader as discussed for the previous embodiments.

Pads or solder bumps may be formed at the ends 275 of the leads 266. Tothat end, solder mask 277 may be patterned over the surface of adhesivelayer 216C and leads 266 as shown in FIG. 19 for the attachment of wiresor solder bumps.

In another optional embodiment shown in FIG. 20, leads 266 may beextended to the bottom surface of the substrate 202. The leads 266extend past the inclined side walls 248, 250 of notches 246 and enterthe adhesive layer 209 within the relief cavity 208 positioned below thefirst subassembly 210. Upon further thinning of the substrate 202, thebottom of leads 266 are exposed and the leads may be extended by themethods previously discussed to create bottom leads 286. Solder mask 227may be patterned over the bottom surface of substrate 202 for theattachment of wires or solder bumps to allow the formation of pads orbumps at the ends 288.

A particular advantage of this arrangement is that either stackedassemblies 230 or individual packages may in turn be stacked andelectrically interconnected, one upon the other by aligning andconnecting using, for instance solder bumps, the respective top ends 275and bottom ends 288. In the example shown, the top ends 275 and bottomends 288 to be connected are align in an appropriate pattern in the x-yplane to allow interconnection.

Because the leads 266 allow testing probes to access the elements,defective subassembly layers may be detected and isolated to allowsorting and rework. Higher-level integration as well as wafer levelrework is facilitated by the ability to stack assemblies 230. Thus,leads disposed at a bottom surface of a unit as illustrated in FIG. 20may be connected to leads provided at a top surface of an adjacent unitthrough conductive masses, e.g., spheres or bumps of conductivematerial, e.g., solder. While having a greater overall thickness,elements from such stacked stack assemblies are functionally repaired tobe equivalent to a non-defective stack assembly 230 and the value of thefunctioning layers 210 may be economically recovered by wafer levelrework.

As shown in FIG. 21, after the notches 246 and various conductiveelements including leads 266 are formed in the stacked assembly 230,individual packages 280 may be created by mechanically cutting throughthe leads 266, the adhesive 209 and the substrate 202, to sever thepackages. The cut are aligned with dicing lanes 218 and 220 at locationsthat are proximate the notches 246 such that the notches 246 are allowedto extend entirely through the stacked assembly 230. Once the cuts havebeen performed, a plurality of stacked individual elements 280 arecreated, with each stacked individual unit 280 containing a plurality ofmicroelectronic elements stacked one upon another. The stackedindividual units 280 as shown in FIG. 22 may be electrically connectedto a microelectronic element such as a substrate, circuit board orcircuit panel via wire bonding or via pads 275 or the solder bumps 274,as shown in FIG. 23.

In a particular example (FIG. 20A), three stacked assemblies 230 of thetype shown in FIG. 20 or FIG. 21 may be stacked and interconnected. Bondwires 2202, 2202′, 2202″ connecting lands 2204, 2204′ and 2204″ of thestacked assemblies provide interconnection to terminals 2206 of acircuit panel 2210. The bond wires may be arranged to connect lands ofadjacent levels as shown in FIG. 20A or each bond wire may directlyconnect a stacked assembly to the circuit panel. Alternatively, some ofthe bond wires connected to a particular stacked assembly may beconnected to another stacked assembly which is not adjacent to theparticular stacked assembly.

As apparent in FIG. 20A, a face 2220″ of a stacked assembly 230″ and aland 2204″ thereon extends beyond a face 2220′ and an edge 2222′ ofstacked assembly 230′ and a land 2204′ thereon, thus permitting thelands 2204′ and 2204″ to be interconnected using bond wire 2202′.Similarly, a face 2220′ of the stacked assembly 230′ and the land 2204′thereon extends beyond a face 2220 and an edge 2222 of stacked assembly230 and a land 2204 thereon, thus permitting the lands 2204′ and 2204 tobe interconnected using bond wire 2202.

The embodiments (FIGS. 7-23) described above result in thin elements 280produced by wafer level packaging. Because the individual layers can befabricated with thickness of approximately 25 micrometers, a total diepackage using a 30 micrometer substrate can be no less than 155micrometers thick. As described, the substrate can be further thinned toreduce the package thickness to less than 125 micrometers.

In the method of fabricating a stacked package as described above (FIGS.7-23), notches 246 are formed in the stacked assembly 230 (FIG. 17). Thenotches typically extend along edges of each microelectronic element212, 212′ aligned with saw lanes 218, 220, etc., such that a series oftraces 224 (FIG. 7C) of each microelectronic element are exposed withinthe notches at the edges. The notches may extend the entire length ofthe respective saw lanes of the stacked assembly 230 or may be a seriesof openings each extending a part of the length of the respective sawlane to which the opening is aligned. As depicted in FIG. 7C, all of thetraces 224 extending from contacts 222″ of microelectronic element 212and all of the traces 224 extending from contacts 222′ ofmicroelectronic element 212′ may be exposed within one notch 246 (FIG.17). Leads 266 (FIG. 18) may then be formed by depositing a primarymetal layer, e.g., by sputtering, electroless deposition, etc., alongedges of the subassemblies 210 exposed within the notches. The primarymetal layer can then be photolithographically patterned into separateleads, followed by electroplating to increase the thickness of leads andif desired, form leads having multiple different metal layers.

Referring to FIG. 24, in a variation of the above embodiment, afterforming the stacked assembly 230 (FIGS. 16-17), instead of formingnotches which expose all of the traces 224 aligned with the saw lanes218, 220 (FIG. 7C) of each microelectronic element 212, 212′, etc.,openings 228, 228′, 228″ are formed in alignment with the saw lanes 218,220, etc. However, unlike the notches 246 (FIG. 17) in theabove-described embodiment, each of the openings 228, 228′, 228″, etc.,exposes no more than a single trace 224, 224′, 224″ of each respectivemicroelectronic element. Typically, traces 224 connected to contacts ofadjacent microelectronic elements 212, 212′ are exposed within anopening 228. Similarly, traces 224′ connected to contacts of theadjacent microelectronic elements are exposed within another 228′ of theopenings, and traces 224 connected to contacts of the adjacentmicroelectronic elements are exposed within another 228″ of theopenings. In the stacked assembly 230, respective traces 224 connectedto microelectronic elements of the stacked subassemblies may be exposedwithin a single opening, but no more than one trace of eachmicroelectronic element is exposed within each opening.

To form leads 266 (FIG. 18) connected to individual ones of the traces224, 224′ and 224″, etc., all openings 228, 228′, 228″, etc., in thestacked assembly can be simultaneously filled with a conductor to formconductive vias connected to single traces of each microelectronicelement. For example, the openings can be filled with a metal to formconductive vias by depositing a primary metal, e.g., by sputtering orelectroless deposition, and then electroplating the resulting structure.Metal remaining from the electroplating step which lies above thesurface of the exposed adhesive or dielectric layer 243C. (FIG. 18) canbe removed, leaving surfaces of individual conductive vias exposed ineach opening 228. Alternatively, the resulting metal layer overlying theuppermost adhesive layer 243C can be patterned by photolithography intoindividual leads 266 (FIG. 18) extending from the vias over layer 243C.Conductive bumps may then be formed at ends of the leads, as shown anddescribed above with reference to FIG. 23.

Reference is now made to FIGS. 25A and 25B, which are illustrations ofapparatus employed in the manufacture of assemblies of the typesdiscussed herein. As seen in FIGS. 25A and 25B, a conventional waferfabrication facility 680 provides complete wafers 681, of the typepartially shown in FIGS. 1A and 1B. Individual wafers 682 are bonded ontheir active surfaces to protective layers 683 by bonding apparatus 685,preferably having facilities for rotation of the wafer 682, the layer683 and epoxy so as to obtain even distribution of the epoxy.

The bonded wafer 686 is thinned at its non-active surface as by grindingapparatus 684 using an abrasive 687. The wafer is then etched at itsnon-active surface, preferably by photolithography, such as by usingconventional spin-coated photoresist, using a mask exposure machine 692for the exposure of light sensitive photoresist 690 through the mask 691and later etching the silicon in a bath 693 using solution 699. Theetched wafer is bonded on the non-active side to protective layer 686 bybonding apparatus 694, which may be essentially the same as apparatus685, to produce a doubly bonded wafer sandwich. The wafer may then bybonded to a second or more wafers.

Notching apparatus 695 partially cuts the bonded wafers in a method offorming a stacked package as described above with reference to FIGS.1-6. The notched wafers are then subjected to anti-corrosion treatmentin a bath 696, containing a chromating solution 698. Alternatively, achemical etching apparatus (not shown) may be used to form notchesexposing one or more traces or openings exposing single traces ofrespective microelectronic elements in accordance with the methods offabrication described above with respect to FIGS. 7-24.

Conductive layer deposition apparatus 700, which operates by vacuumdeposition techniques, is employed to produce a conductive layer on oneor more surfaces of each die of the wafers. The conductive layerdeposition apparatus 700 may be employed prior to the two wafers beingassembled together. Configuration of the contact strips or lead bridgesis carried out preferably by using conventional electro-depositedphotoresist 701. The photoresist 701 is applied to the stacked wafers707 in a photoresist bath assembly 702. The photoresist 701 ispreferably light configured by a UV exposure system 704, which may beidentical to system 692, using a mask 705 to define suitable etchingpatterns. The photoresist is then developed in a development bath 706,and then the wafer is etched in a metal solution 708 located in anetching bath 710, thus providing a conductor configuration.

The exposed conductive strips are then plated, preferably by electrolessplating apparatus 712. The stacked wafers are then diced into individualprepackaged integrated devices. Preferably the dicing blade 714 shouldbe a diamond resinoid blade of thickness 4-12 mils, which corresponds tothe thickness of the saw lanes.

Referring to FIG. 26, a stacked assembly 280 (FIG. 22) is shown having arear face 2602 attached, e.g., by way of an adhesive (not shown), to aninterconnection element 2610 or circuit panel. Bond wires 2604electrically connect ends 2668 of leads 2666 to contacts 2606 on aninner face 2601 of an interconnection element 2610. In turn, thecontacts 2606 are connected by way of vias 2608 to conductive bumps orballs 2612, e.g., solder balls exposed at an outer face 2611 of theinterconnection element. As further shown in FIG. 26, a microelectronicelement, e.g., a semiconductor chip, may be connected to leads 2666extending above a front face 2622 of a microelectronic element 210 ofthe stacked assembly 280 through conductive masses 2624, e.g., solderballs, among others. In a particular embodiment, microelectronicelements 210 included in the stacked assembly include memory devices,including, without limitation, dynamic random access memories (“DRAMs”),static random access memories (“SRAMs”), erasable programmable read onlymemories (“EPROMs”), e.g., such memories which can be erased viaexposure to radiation or which can be erased and reprogrammed viaelectrical means, or flash memory, which is a form of nonvolatile randomaccess memory in which data can be stored, altered and overwrittenwithout having to reprogram the chip.

In a particular example, the chip 2620 includes a processor, e.g.,microprocessor or microcontroller element, among others, the processorcapable of accessing and executing a program in connection with use ofthe memory resources contained in the stacked assembly 280. In anotherexample, the chip 2620 may contain circuitry which matches that of oneor more of the microelectronic elements 210 in function or circuitry. Insuch case, chip 2620 can serve as a replacement unit connected by way ofleads 2666 to other microelectronic elements 210, the chip 2620connected by way of bond wires 2604 to the interconnection element. Toset up the chip 2620 as a repair-replacement unit for an assembly havinga defective microelectronic element 210, leads extending from thatdefective microelectronic element can be electrically disconnected fromcontacts at the front face 2622, e.g., by mechanical or lasertechniques. Alternatively, electrically fusible elements (e.g.,electrical fuses or antifuses) of the chip 2620 or of the defectiveelement 210 can be activated. The repair chip 2620 can be electricallyconnected in place of the defective chip of the stacked assembly.

FIG. 27 illustrates a variation of the embodiment illustrated in FIG.26, wherein a chip 2720 is mounted with a front face 2722 thereof facingaway from the front face 2622 of the adjacent microelectronic element210. Bond wires 2704 connect pads 2716 of the chip to contacts 2706 ofthe interconnection element. In a further variation shown in FIG. 28,bond wires 2804 connected to the pads 2704 of the chip 2720 areconnected to exposed contacts 2806 on the stacked assembly. The exposedcontacts 2806 may be connected to one or more of the microelectronicelements of the stacked assembly by way of leads 2666. Alternatively, orin addition thereto, the exposed contacts 2806 may be connected to theinterconnection element by way of other bond wires 2814.

In another variation shown in FIG. 29, ends 2968 of leads 2966 exposedat a rear face 2902 of a stacked assembly 230 (as described above withreference to FIG. 20) are connected to contacts 2906 of theinterconnection element 2910 by way of conductive masses, e.g., solderballs, among others. FIG. 30 illustrates a variation of the embodimentshown in FIG. 29, in which a chip 2720 mounted to the front face 3001 ofthe stacked assembly is electrically connected directly to theinterconnection element 3010 by way of bond wires 3004 which extend frompads on the chip 2720 to contacts 3006 of the interconnection element.In another variation shown in FIG. 31, a chip 2620 is flip-chip mountedto ends of leads 2666 or other contacts exposed at the front face 3001of the stacked assembly. In a further variation shown in FIG. 32, astacked assembly 280 is flip-chip mounted to an interconnection element2610, with the front face 3201 of the stacked assembly confronting afront face 2601 of the interconnection element.

Although the invention herein has been described with reference toparticular embodiments, it is to be understood that these embodimentsare merely illustrative of the principles and applications of thepresent invention. It is therefore to be understood that numerousmodifications may be made to the illustrative embodiments and that otherarrangements may be devised without departing from the spirit and scopeof the present invention as defined by the appended claims.

The invention claimed is:
 1. A microelectronic package comprising: afirst microelectronic assembly including a plurality of firstsemiconductor chips having respective first chip contacts electricallyconnected with one another, and at least one first conductive element ata face of the first assembly electrically connected with the first chipcontacts; a second microelectronic assembly including a plurality ofsecond semiconductor chips having second chip contacts electrically withone another, and at least one second conductive element at a face of thesecond assembly electrically connected with the second chip contacts; abond wire electrically connecting the at least one first conductiveelement with the at least one second conductive element; and wherein atleast one of the first assembly or the second assembly includes apackage terminal at the face thereof, wherein the package terminal is abump solderable to a conductive contact of an external component and iselectrically connected with the at least one first conductive elementand the at least one second conductive element.
 2. The microelectronicpackage as claimed in claim 1, wherein at least one of the firstassembly or the second assembly is configured to provide memory storagearray function.
 3. The microelectronic package as claimed in claim 1,wherein semiconductor chips of the plurality of semiconductor chips inat least one of the first assembly or the second assembly are arrangedin a stack.
 4. The microelectronic package as claimed in claim 1,further comprising an electrically conductive joining unit joined to thepackage terminal.
 5. The microelectronic package as claimed in claim 1,wherein the bond wire extends about an edge of one of the first assemblyand the second assembly.
 6. The microelectronic package as claimed inclaim 1, wherein at least one of the at least one first or the at leastone second conductive elements is a land.
 7. A method of fabricating amicroelectronic assembly comprising: stacking a first microelectronicassembly onto a second microelectronic assembly, the firstmicroelectronic assembly including a plurality of first semiconductorchips having respective first chip contacts electrically connected withone another, and at least one first conductive element at a face of thefirst assembly electrically connected with the first chip contacts, thesecond microelectronic assembly including a plurality of secondsemiconductor chips having respective second chip contacts electricallyconnected with one another, and at least one second conductive elementat a face of the second assembly electrically connected with the secondchip contacts; and forming a bond wire electrically connecting the atleast one first conductive element with the at least one secondconductive element, the at least one first and second conductiveelements being electrically connected with a package terminal at theface of at least one of the first assembly or the second assembly, thepackage terminal being a bump solderable to a conductive contact of anexternal component.
 8. The method as claimed in claim 7, wherein atleast one of the first assembly or the second assembly is configured topredominantly provide memory storage array function.
 9. The method asclaimed in claim 7, wherein semiconductor chips of the plurality ofsemiconductor chips in at least one of the first assembly or the secondassembly are arranged in a stack.
 10. The method as claimed in claim 7further comprising: joining an electrically conductive joining unit tothe package terminal.
 11. The method as claimed in claim 7, wherein thestep of forming the bond wire forms the bond wire to extend about anedge of one of the first assembly and the second assembly.
 12. Themethod as claimed in claim 7, further comprising functionally testing atleast one of the first or second microelectronic assemblies prior to thestep of stacking.
 13. The method as claimed in claim 7, furthercomprising functionally testing each of the first or secondmicroelectronic assemblies prior to the step of stacking.
 14. The methodas claimed in claim 7, wherein at least one of the first or secondmicroelectronic assemblies units is of a wafer.
 15. The method asclaimed in claim 7, wherein at least one of the first or secondconductive elements is a land.
 16. The microelectronic package asclaimed in claim 1, wherein the external component is a circuit board orcircuit panel.
 17. The method as claimed in claim 7, wherein theexternal component is a circuit board or circuit panel.
 18. Amicroelectronic assembly comprising: a microelectronic package and acomponent external to the microelectronic package, where themicroelectronic package includes: a first microelectronic assemblyincluding a plurality of first semiconductor chips having respectivefirst chip contacts electrically connected with one another, and atleast one first conductive element at a face of the first assemblyelectrically connected with the first chip contacts; a secondmicroelectronic assembly including a plurality of second semiconductorchips having second chip contacts electrically with one another, and atleast one second conductive element at a face of the second assemblyelectrically connected with the second chip contacts; a bond wireelectrically connecting the at least one first conductive element withthe at least one second conductive element; and wherein at least one ofthe first assembly or the second assembly includes a package terminal atthe face thereof, wherein the package terminal is soldered to aconductive contact of the external component and is electricallyconnected with the at least one first conductive element and the atleast one second conductive element.
 19. A method of fabricating amicroelectronic assembly comprising: stacking a first microelectronicassembly onto a second microelectronic assembly, the firstmicroelectronic assembly including a plurality of first semiconductorchips having respective first chip contacts electrically connected withone another, and at least one first conductive element at a face of thefirst assembly electrically connected with the first chip contacts, andthe second microelectronic assembly including a plurality of secondsemiconductor chips having respective second chip contacts electricallyconnected with one another, and at least one second conductive elementat a face of the second assembly electrically connected with the secondchip contacts; forming a bond wire electrically connecting the at leastone first conductive element with the at least one second conductiveelement, the at least one first and second conductive elements beingelectrically connected with a package terminal at the face of at leastone of the first assembly or the second assembly; and soldering thepackage terminal to a conductive contact of the external component, thepackage terminal being electrically connected with the at least onefirst conductive element and the at least one second conductive element.